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TDK Ventures Backs Mixx Technologies to Transform AI Infrastructure With Breakthrough Optical Interconnect Platform

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Artificial Intelligence continues to push the limits of today’s data infrastructure. As models grow larger and datasets expand exponentially, traditional interconnect technologies have become one of the biggest bottlenecks in scaling advanced AI workloads. A major step toward solving that bottleneck just arrived.

TDK Ventures, the corporate venture arm of TDK Corporation, has announced a strategic investment in Mixx Technologies, a San Jose–based pioneer in next-generation optical interconnects. The investment forms part of Mixx’s $33 million oversubscribed Series A round, led by ICM HPQC Fund with participation from SystemIQ Capital and others.

The goal? Accelerate the deployment of Mixx’s breakthrough AI connectivity platform—technology designed to fundamentally upgrade the way data moves inside datacenters powering AI and high-performance computing (HPC).


Solving AI’s Data Bottleneck With System-Level Optical Interconnects

As AI models such as LLMs and multimodal architectures continue to expand, the communication demands between GPUs have skyrocketed. Traditional electrical interconnects—and even incremental optical solutions—struggle to keep up.

Mixx Technologies is taking a dramatically different approach.

At the heart of their innovation is HBxIO™, a next-generation co-packaged optical (CPO) engine purpose-built to scale AI inference networks. Instead of treating connectivity as an add-on component, Mixx designed its engine from a rack-to-chip system-level perspective, merging advanced photonics with next-gen packaging to optimize:

  • Performance

  • Power efficiency

  • Latency

  • Reliability

This holistic architecture enables something unprecedented: switchless GPU clusters. By removing traditional switching layers, Mixx unlocks highly parallelized, ultra-low-latency compute scaling—exactly what modern AI workloads need.


A Strong Vote of Confidence From TDK Ventures

According to Nicolas Sauvage, President of TDK Ventures, Mixx perfectly embodies the deep-tech innovation the firm seeks to support:

“Mixx’s optical engine—with its unprecedented ultra-high radix—substantially flattens scale-up networking to enable the next generation of highly parallelized, low-latency AI clusters. We’re proud to support a team building foundational technology to make large-scale AI infrastructure more efficient, interconnected, and sustainable.”

This investment aligns with TDK Ventures’ mission to support technologies that bridge the physical and digital worlds, particularly those enabling responsible and scalable AI growth.


Leadership With Deep Domain Expertise

Mixx Technologies was founded by industry leaders:

  • Vivek Raghuraman, CEO

  • Dr. Rebecca K. Schaevitz, Chief Product Officer

Both previously played key roles in the influential Broadcom CPO team and bring decades of experience from companies such as Rockley Photonics, Intel, and Corning. Their track record includes bringing multiple advanced interconnect platforms to full-scale commercial deployment.

Raghuraman describes Mixx’s mission simply:

“We are on a mission to enable cost-effective scaling, delivering higher performance per dollar per watt for sustainable compute connectivity. The path to continued AI growth lies in a holistic system transformation driven by open standards.”

Why This Matters for the Future of AI

The industry has been searching for solutions to break through the bandwidth, efficiency, and scalability constraints of today’s GPU networks. With AI workloads growing faster than hardware alone can evolve, the need for innovative interconnect architectures has never been greater.

Mixx’s platform directly addresses this challenge by:

  • Eliminating data bottlenecks

  • Enabling large-scale, highly parallel GPU clusters

  • Reducing power consumption in AI datacenters

  • Providing a reliable, scalable foundation for next-gen AI systems

If successful at full deployment, Mixx could redefine the backbone of future AI datacenters—and potentially accelerate progress across countless AI-driven applications.


About TDK, TDK Ventures & Mixx Technologies

TDK CorporationA global leader in electronic components and advanced materials, TDK posted $14.4B in FY2025 revenues and employs ~105,000 people worldwide.

TDK VenturesFounded in 2019, TDK Ventures invests in startups advancing materials science, energy, power, robotics, industrial tech, next-gen mobility, IoT/IIoT, and AI infrastructure.

Mixx TechnologiesHeadquartered in San Jose with operations in India and Taiwan, Mixx builds next-gen optical interconnect solutions for AI and HPC workloads. Learn more at: https://mixxtech.io/


Final Thoughts

The collaboration between TDK Ventures and Mixx Technologies signals a pivotal moment for the future of AI infrastructure. As demand for massive-scale compute continues to rise, innovations in connectivity—often overlooked yet absolutely critical—will determine how far AI can truly go.

If Mixx delivers on its vision, the industry could see a new era of ultra-efficient, highly scalable, environmentally sustainable AI datacenters.

A breakthrough not just for one company, but potentially for the entire AI ecosystem.

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